Sintered nanoparticles interconnect
Howard Wang of Binghampton University, US, gave an update on the performance of sintered metal nanoparticles. The team is pulling together technology to realize high-performance roll-to-roll electronics and has been successful in using inkjet-printed metal nanoparticles to interconnect devices on the flexible and often temperature sensitive substrates.
Wang sources his particles from NanoMas - a supplier of silver nanoparticles measuring 2 nm in diameter. The reduction in melting point with particle size means that the researchers can run their sintering process at just 100 degC, which opens the door to a wide range of roll-to-roll compatible films.
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