To test the concept, two circuit boards featuring a pattern of gold nanowire arrays (synthesized by porous alumina template-assisted electrodeposition) were connected to each other under different preloads. The parasitic resistance across the connection was measured using a four-point probe method after the preload was completely removed. Also, normal and shear bonding strengths were evaluated.

The team demonstrated that the mechanical bonding enables normal and shear bonding strengths of more than 5 N/cm2. Also, the researchers found that the parasitic resistance of a pair of surface fasteners is only approximately 2 Ω.

Surface fasteners based on high melting point metallic nanowires are temperature resistant for many critical applications. In addition, bonding without solder material is a positive step for the recycling of rare metals in SMDs.

Further details can be found in the journal Nanotechnology.