Mar 3, 2010
EV Group (EVG)
Solutions for 3D Integration and TSV (Through-Silicon Via)
Wafer level packaging employs specific alignment and wafer bonding techniques as enabling solutions for the stacking of wafers and three-dimensional integration of devices. This video features typical wafer processing steps and results, showing equipment from EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets.
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