NANO TECH 2010—TOKYO, JAPAN, February 9, 2010 – NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan. NILCom will present solutions and services, which will drive the further commercialization of nanoimprint lithography. Five consortium members will highlight the latest equipment, material and process developments at booth C 13.
The NILCom booth at nano tech 2010 will host the following consortium members:
Applied MicroStructures Inc., Santa Clara, USA (www.appliedmst.com) Focus: Equipment and processes for functional coatings and anti-stiction layers
EV Group (EVG), St. Florian/Inn, Austria (www.EVGroup.com) Focus: Equipment for all imprint lithography processes – incl. UV-NIL, HE and micro-contact printing
micro resist technology GmbH, Berlin, Germany (www.microresist.de) Focus: Resists and working stamps for nanoimprint lithography
NIL Technology ApS, Lyngby, Denmark (www.nilt.com) Focus: Stamps of all forms of nanoimprint lithography
PVA TePla AG, Feldkirchen, Germany (www.pvatepla.com) Focus: NIL equipment for stamp cleaning and residual layer removal
Source: EV Group
About NILCom
Founded in 2004, NILCom is a consortium of imprint lithography supply chain companies and research organizations, working together to assist customers in advancing their ideas into a manufacturing environment. Through its total solution path, combining the members’ diverse knowledge base and skill sets to deliver complete process solutions for imprint lithography applications, NILCom drives continuous improvement into all aspects of the imprint lithography supply chain. In addition to offering process solutions and continuous imprint infrastructure advances, NILCom educates the imprint lithography community, connecting it with new market trends, materials, systems, and processes. For more information about NILCom and its members, please visit www.NILCom.org