Advanced Thermal Management & Packaging Materials
About this event
Advanced Thermal Management and Packaging Materials is a two-day course that covers the increasing number of advanced thermal management materials and provides an in-depth discussion of properties, manufacturing processes, applications, cost, lessons learned, typical development programs, and future directions. Traditional materials are discussed for reference. The focus is on materials used for heat spreaders, heat sinks, substrates, printed circuit boards (PCBs), enclosures/chassis, etc., but we also consider emerging advanced thermal interface materials (TIMs). Participants are invited to bring their thermal management problems for discussion. This course is designed for every manager, engineer, and technician concerned with packaging materials, using semiconductor components, or supplying materials to the industry.