Reinforced Epoxy Adhesive Improves Structural Bonding Mar 17, 2010

Comprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond’s EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond EP30R produces high strength bonds to metals, glass, ceramics, vulcanized rubbers and many plastics. The structural adhesive is recommended for use over the temperature range of -60°F to more than 250°F and it resists thermal cycling and chemicals. Cure shrinkage of only 0.0003 inches/in preserves precise dimensional tolerances of assembled parts. Severe mechanical or thermal stresses do not weaken adhesive performance. The cured epoxy is an excellent electrical insulator.