Low Viscosity, Room Temperature Curing Epoxy Complies With FDA and USP Class VI Jun 15, 2011

Offering a forgiving 1 to 1 mix ratio by weight or volume, EP21LV cures at room temperature in 24 to 36 hours or faster at elevated temperatures. This system is unique in that the rigidity of its cure can be altered by adjusting its mix ratio.
Serviceable over the wide range of -65°F to +250°F, this epoxy features a long working life of 60 to 75 minutes for a 200 gram mass. EP21LV bonds well to a variety of substrates. It resists thermal cycling as well as water, oils, fuels, bases, acids and salts. EP21LV produces durable bonds with a tensile strength of 7,600 psi, a shear strength over 2,900 psi and an elongation of 4.8% at 75°F. This versatile two-component epoxy has a volume resistivity of 1015 ohm-cm and a coefficient of thermal expansion of 53 in/in x 10-6/ °C.

More products from this company

• Flexibilized, Thermally Conductive One Part B-Stage Epoxy Resists High Heat Jul 4, 2012
• Two Component Silicone Combines Flexibility and High Temperature Resistance May 22, 2012
• Abrasion Resistant, Flexible Adhesive is Serviceable at Cryogenic Temperatures May 2, 2012
• Chemically Resistant, Optically Clear Adhesive Cures Upon Exposure to UV Light Apr 12, 2012
• One Part Epoxy Offers Exceptionally High Tensile Strength Mar 2, 2012
• Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved Jan 18, 2012
• High Performance, UV Curable Epoxy with Enhanced Chemical Resistance Nov 22, 2011
• Medical Grade Epoxy Withstands High Temperatures and Repeated Sterilizations Aug 2, 2011
• Food Grade Epoxy Resists High Temperatures Meets FDA CFR 175.30 Jun 6, 2011