Low Viscosity, Room Temperature Curing Epoxy Complies With FDA and USP Class VI Jun 15, 2011
154 Hobart Street
Master Bond EP21LV is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements.
Offering a forgiving 1 to 1 mix ratio by weight or volume, EP21LV cures at room temperature in 24 to 36 hours or faster at elevated temperatures. This system is unique in that the rigidity of its cure can be altered by adjusting its mix ratio.
Serviceable over the wide range of -65°F to +250°F, this epoxy features a long working life of 60 to 75 minutes for a 200 gram mass. EP21LV bonds well to a variety of substrates. It resists thermal cycling as well as water, oils, fuels, bases, acids and salts. EP21LV produces durable bonds with a tensile strength of 7,600 psi, a shear strength over 2,900 psi and an elongation of 4.8% at 75°F. This versatile two-component epoxy has a volume resistivity of 1015 ohm-cm and a coefficient of thermal expansion of 53 in/in x 10-6/ °C.
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