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Product details

Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved Jan 18, 2012

Company details

Master Bond
154 Hobart Street
Hackensack
NJ
07601
United States

Tel: +1-201-343-8983
Fax: +1-201-343-2132

Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and meets USP Class VI requirements for medical applications.

This silver-filled epoxy adhesive/sealant has remarkable electrical conductivity with a volume resistivity less than 0.001 ohm cm. Serviceable over the wide temperature range of -60°F to 400°F, EP3HTSMED is resistant to severe thermal cycling and many chemicals.

EP3HTSMED is a thixotropic paste and has a specific gravity of 2.90 at 77°F. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F. With minimal shrinkage during cure and a Shore D hardness of 60 to 80, EP3HTSMED bonds well to a variety of substrates.

This one component adhesive is packaged in syringes or glass jars. EP3HTSMED has a shelf life of 6 months in a glass jar and a shelf life 3 months when stored in a syringe at room temperature.

 

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