Park NX-Wafer fully automates the automatic defect review process for bare wafer Jul 15, 2014
KANC 4F, Iui-Dong 906-10
Korea, Republic of
A revolutionary AFM design for bare wafer manufacturing that fully automates the automatic defect review process and increases production throughput by an astounding 1,000%.
Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the automatic defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry. This fully automated defect review and identification system enables a critical inline process to classify defect types and source their origin through high resolution 3D imaging only available at Park Systems, the world's leading AFM provider.
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